With the demand for stable AI data centers growing, Exascale Labs and Compal Electronics are teaming up to present an AI infrastructure solution at COMPUTEX Taipei 2026. The exhibition will take place from June 2 to 5 at key venues in Taipei, including the Nangang Exhibition Center and the Taipei World Trade Center.
This partnership combines Exascale's Modular Data Center (MDC) and high-voltage direct current (HVDC) systems with Compal’s advanced AI server technology, featuring their latest models optimized for AI workloads. The goal is to deliver a fully integrated data center stack that simplifies deployment for enterprise and industry partners, allowing for a quicker transition from order to operational capacity compared to traditional setups.
The integrated solution includes four main components: computing power, cooling technology, infrastructure, and power management. Compal’s AI servers, like the OG231-2-L1 and SGX30-2 systems, are specifically designed for high-density AI model training and inference. Their Direct Liquid Cooling (DLC) technology effectively manages heat from GPUs, which is essential for AI applications.
Exascale’s MDC enhances this by providing a pre-integrated system that combines power, cooling, and networking within a factory-built container. This modular design supports rapid deployment, meeting the high rack densities demanded by modern AI workloads. The incorporation of HVDC technology also minimizes energy loss during power conversion, improving overall efficiency and reducing the physical space needed for electrical components.
Dr. Hoansoo Lee, CEO of Exascale Labs, emphasized the benefits of this collaboration, stating, “Compal builds some of the most advanced AI servers in the industry, and Exascale builds the modular, high-voltage infrastructure designed to power them at scale. By pairing Compal’s AI servers and direct liquid cooling with our MDC and HVDC/SST stack, joint customers can move from purchase order to live AI capacity in months rather than years — without compromising on density or efficiency.”
This approach not only speeds up the deployment process but also enables organizations to make the most of their available floor space for revenue-generating GPU racks. As AI continues to expand across various industries, the efficiency and capacity of data centers will become increasingly important.
The COMPUTEX 2026 event, themed “AI Together,” serves as an excellent platform for showcasing this collaboration. Attendees can witness how the combined technologies from Exascale Labs and Compal Electronics can redefine AI infrastructure, setting new standards for speed and efficiency in data center deployment.
As enterprises seek to boost their AI capabilities, the solutions unveiled at COMPUTEX 2026 could significantly influence the future of AI data centers, driving innovation and efficiency throughout the sector.
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